This device is applied to the micro - assembly chip dot- adhesive patch process. t has the characteristics of multi-thread, multi-timing, flexible process combination, complex logicand strict process control. Key technologies such as precisealignment of micro chips, multi-axis high-precision closed-loop motion control, automatic height measurement and precisepressure control are broken. Realize the functions of point glue,dip glue, patch, free combination of various feeding methods,intelligent switch of patch head, automatic transmission ofassembly line,etc.High speed, high precision, multi-variety,mass production capacity.