The machine mainly accomplishes the hole punching positioning, as wellas the cavity formation. It is the primary equipment of LTCC multilayer substrate manufacturing.

The machine adopts mechanism punching mode and can meet two techniques with or without frames. The machine can automatically load and unload green ceramic sheets.

Moreover, it can install multi-punching units.CCD camera system is used to automatically locate punching units and reactive images, and can accept DXF files.Its operation

interface is friendly and convenient. Several series of machines are shown below.