The manufacture of various bumps,copperpillars, graphics, RDL,TSV in the advanced ICpackaging process;Precision electroforming of MEMSdevice microstructure.Workpiece specification: wafer(8 inch and

below), square piece, etc; Uniformity of coatingthickness≤±5%;The defect-free filing can be wellcompleted in the micropore with diameter less than20um and depth width ratio greater than 5:1。