Chemically deposited nickel-palladium-gold metallayers in Al/Cu material base; Can be used for PCB,ceramic substrate andotherpackagingsubstratesurfacetreatment;ElectrolessNi/Pd/Austraightgoodflatness,weldablity,corrosion resitance,wire bingding ablity;Can be used to manufacture UBM in flipchip packagingtechnology; Provides highly reliable electrical andmechanical connections to both the circuit and solderbumps of the chip。